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25 January 2000 Nondestructive characterization of the film quality and stress states in diamond films on various substrates
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Proceedings Volume 4064, Third International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering; (2000) https://doi.org/10.1117/12.375453
Event: Third International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering, 1999, St. Petersburg, Russian Federation
Abstract
Diamond films deposited on various substrates were characterized nondestructively by Raman spectroscopy and X- ray diffraction (XRD) to evaluate their stress states and film quality. The X-ray diffraction method is further divided into two methods, i.e., the low incident beam angle X-ray diffraction, and Clemens-Bain method for the textured films. The whole-pattern-fitting structure refinement method, or called `Rietveld method' was adapted in XRD method to improve its accuracy. The film adhesion, film morphology and film structures including its non-diamond carbon content, crystal size, texture coefficient, film thickness and surface roughness were also examined. The correlations between structure and residual stress of the films on various substrates and under various deposition and pretreatment conditions were analyzed. The feasibility of nondestructive evaluation the film quality and stress states, and the origins of the residual stress of the films were discussed.19
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cheng-Tzu Kuo, Jin-Yu Wu, and Shien-Lien Chou "Nondestructive characterization of the film quality and stress states in diamond films on various substrates", Proc. SPIE 4064, Third International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering, (25 January 2000); https://doi.org/10.1117/12.375453
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