Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections

Daisuke Miyazaki; Yuji Ohno; Kenji Matsushita

doi:10.1117/12.386794

24 May 2000 Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections

Daisuke Miyazaki, Yuji Ohno, Kenji Matsushita

Proceedings Volume 4089, Optics in Computing 2000; (2000) https://doi.org/10.1117/12.386794
Event: 2000 International Topical Meeting on Optics in Computing (OC2000), 2000, Quebec City, Canada

Abstract

An optical packaging scheme based on alignment-free optical modules for free-space interconnection is presented. Solder- bump-bonding technique is introduced to achieve precise self-alignment in free-space optical system. The proposed method is verified by experimental fabrication of optical modules.

Citation Download Citation

Daisuke Miyazaki, Yuji Ohno, and Kenji Matsushita "Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections", Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); https://doi.org/10.1117/12.386794

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available