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24 May 2000 Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections
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Proceedings Volume 4089, Optics in Computing 2000; (2000) https://doi.org/10.1117/12.386794
Event: 2000 International Topical Meeting on Optics in Computing (OC2000), 2000, Quebec City, Canada
Abstract
An optical packaging scheme based on alignment-free optical modules for free-space interconnection is presented. Solder- bump-bonding technique is introduced to achieve precise self-alignment in free-space optical system. The proposed method is verified by experimental fabrication of optical modules.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daisuke Miyazaki, Yuji Ohno, and Kenji Matsushita "Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections", Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); https://doi.org/10.1117/12.386794
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