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24 May 2000 Packaging of an optoelectronic-VLSI chip supporting a 32 X 32 array of surface-active devices
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Proceedings Volume 4089, Optics in Computing 2000; (2000)
Event: 2000 International Topical Meeting on Optics in Computing (OC2000), 2000, Quebec City, Canada
Innovative approaches to the packaging of a high-performance module accommodating a 32 X 32 array of surface-active devices indium bump bonded to a 9 X 9 mm2 VLSI chip are described. The module integrates a mini-lens array, a copper heat spreader, a thermoelectric cooler and an aluminum heatsink. The mini-lens array is aligned and packaged with the chip using a novel six degrees of freedom alignment technique. The module is compact (44 X 44 X 45 mm3), easy to assemble and can be passively removed and inserted into a free-space optical system with no need for further adjustments. The chip is mounted directly on a flexible printed-circuit board using a chip-on-board approach, providing 207 bond pad connections to the chip. The junction-to-TEC thermal resistance is only 0.4 degree(s)C/W.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael H. Ayliffe, D. R. Rolston, E. L. Chuah, Eric Bernier, Feras S. J. Michael, D. Kabal, Andrew G. Kirk, and David V. Plant "Packaging of an optoelectronic-VLSI chip supporting a 32 X 32 array of surface-active devices", Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000);


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