Translator Disclaimer
15 December 2000 Low-noise readout circuit for uncooled infrared FPA
Author Affiliations +
A low-noise architecture for uncooled microbolometer focal plane arrays is described. The on-chip readout circuit contains an integration circuit in which the bolometer current is directly injected into a capacitor, and exhibits extremely low noise with no decrease in signal. The simple configuration of the integration circuit makes it possible to operate more circuits in parallel, and increases the integration time and number of pixels. The bias circuit for the integration circuit is formed on the chip to reduce the effect of changes in the substrate temperature. The equivalent input noise, in which all readout noise is converted into that at the bolometer node, was 6.2(mu) V rms. A noise at this level is so low that can loosen the required TCR in the bolometer material. A 37-micrometers -pitch 320 x 240 ROIC was fabricated, and its expected NETD was 67-34 mK at a TCR of 1-2%/K. This architecture makes it possible to produce low-cost miniature cameras.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Akio Tanaka, Kazuhiro Chiba, Tsutomu Endoh, Kuniyuki Okuyama, Akihiro Kawahara, Kiyoshi Iida, and Nanao Tsukamoto "Low-noise readout circuit for uncooled infrared FPA", Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000);


High performance BGMI circuit for VLWIR FPAs
Proceedings of SPIE (September 11 2013)
Low-noise readout circuit for SWIR focal plane arrays
Proceedings of SPIE (May 03 2017)
CCD/CMOS hybrid FPA for low light level imaging
Proceedings of SPIE (September 07 2005)
Design of dual-color ROIC with double sharing capacitor
Proceedings of SPIE (December 05 2012)
Ultra low power ADC on chip for high performance IR...
Proceedings of SPIE (May 06 2009)

Back to Top