Deep cavity-shaped diaphragm for enhancement of microphone mechanical sensitivity

Xinxin Li; Rongming Lin; Huatsoon Kek

doi:10.1117/12.395641

15 August 2000 Deep cavity-shaped diaphragm for enhancement of microphone mechanical sensitivity

Xinxin Li, Rongming Lin, Huatsoon Kek

Proceedings Volume 4176, Micromachined Devices and Components VI; (2000) https://doi.org/10.1117/12.395641
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

Presented in this paper is the investigation on sensitivity of micromachined condenser microphone. The sound-sensitive diaphragm of the microphone is formed by surface micromachined thin-film that is normally initially stressed due to the deposition process of the thin-film. Three varieties of diaphragm constructions, conventional flat diaphragm (FD), corrugated diaphragm (CD) and deep cavity-shaped diaphragm (DCD), are involved into the study. Both analysis and finite element model (FEM) are used for comparison of the mechanical sensitivity of the different kinds of diaphragm. Reasonable initial stress range of poly crystalline silicon thin films is assumed for the microphones. The DCD shows a much higher mechanical sensitivity compared to the other two kinds of diaphragm for the assumed film-stress range. A fabrication technology of low tensile-stress poly-silicon film is also provided and proposed for the high sensitivity microphone with the DCD.

Citation Download Citation

Xinxin Li, Rongming Lin, and Huatsoon Kek "Deep cavity-shaped diaphragm for enhancement of microphone mechanical sensitivity", Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); https://doi.org/10.1117/12.395641

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KEYWORDS

Finite element methods

Thin films

Silicon films

Samarium

Silicon

Modal analysis

Acoustics

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