Paper
15 August 2000 Development of silicon ultrasonic transducer using micromachining
Giosue Caliano, Fabio Galanello, Vittorio Foglietti, Elena Cianci, Alessandro Caronti
Author Affiliations +
Proceedings Volume 4176, Micromachined Devices and Components VI; (2000) https://doi.org/10.1117/12.395636
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Ultrasonic transducers are generally based on the piezoelectric effect and they are used in a variety of applications (medical imaging, NDE, ranging). Some of the main reasons for choosing an alternative technology, based on electrostatic effect, are low impedance mismatch with air and in water, low energy density, high efficiency, low costs, good integration with control electronics. Capacitive ultrasonic transducer consists in a parallel plates capacitor (like a condensor microphone) with a fixed electrode and a free one (membrane). A cMUT (capacitive Micromachined Ultrasonic Transducer) consists of an array of capacitive ultrasonic transducer with a metallized membranes suspended on silicon bulk. The membrane thickness is 0.4 micrometers . Tests of these transducers ( 2.5 MHz) fabricated in our laboratories are in progress.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Giosue Caliano, Fabio Galanello, Vittorio Foglietti, Elena Cianci, and Alessandro Caronti "Development of silicon ultrasonic transducer using micromachining", Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); https://doi.org/10.1117/12.395636
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Silicon

Transducers

Ultrasonics

Annealing

Silicon films

Etching

Plasma enhanced chemical vapor deposition

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