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10 August 2000 Fracture tests of etched components using a focused ion beam machine
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Proceedings Volume 4180, MEMS Reliability for Critical Applications; (2000) https://doi.org/10.1117/12.395707
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Many optical MEMS device designs involve large arrays of thin (0.5 to 1 (mu) m) components subjected to high stresses due to cyclic loading. These devices are fabricated from a variety of materials, and the properties strongly depend on size and processing. Our objective is to develop standard and convenient test methods that can be used to measure the properties of large numbers of witness samples, for every device we build. In this work we explore a variety of fracture tests configurations for 0.5 (mu) m thick silicon nitride membranes machined using the Reactive Ion Etching (RIE) process. Testing was completed using an FEI 620 dual focused ion beam milling machine. Static loads were applied using a probe, and dynamic loads were applied through a piezo-electric stack mounted at the base of the probe. Results from the tests are presented and compared, and application for predicting fracture probability of large arrays of devices are considered.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jonathan L. Kuhn, Rainer K. Fettig, Samuel Harvey Moseley Jr., Alexander S. Kutyrev, and Jon Orloff "Fracture tests of etched components using a focused ion beam machine", Proc. SPIE 4180, MEMS Reliability for Critical Applications, (10 August 2000); https://doi.org/10.1117/12.395707
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