OPC reticle inspection techniques

Aihua Dong; Bryan W. Reese

doi:10.1117/12.410743

22 January 2001 OPC reticle inspection techniques

Aihua Dong, Bryan W. Reese

Author Affiliations +

Proceedings Volume 4186, 20th Annual BACUS Symposium on Photomask Technology; (2001) https://doi.org/10.1117/12.410743
Event: Photomask Technology, 2000, Monterey, CA, United States

Abstract

Current manufacturing techniques for advanced wafers require reticle patterns to contain a variety of OPC structures. These structures include several types and sizes of serifs and assist bars creating many technical challenges for reticle inspection. While these OPC structures have evolved over the past few years, so has KLA-Tencor’s inspection algorithm product line. Photronics and KLA-Tencor are jointly examining the performance of two main algorithms (AOP and ATSdb) regarding their ability to inspect several production reticles containing various serifs and assist bars. By examining the results of these algorithms, their ability to inspect OPC reticle patterns can be compared. Part of the test criteria includes examining the number of real and nuisance defects produced by each inspection. To inspect a variety of serifs and assist bars, each algorithm requires their default sensitivity settings to be modified. These sensitivity settings are then used to inspect a Verimask to reveal their relative sensitivity capabilities. Finally, by comparing the sensitivity results from these Verimask inspections, further analysis of the performance for these algorithms can be accomplished.

Citation Download Citation

Aihua Dong and Bryan W. Reese "OPC reticle inspection techniques", Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); https://doi.org/10.1117/12.410743

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