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12 February 2001 Enhancement of placement accuracy for SMD via development of a new illumination system
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Proceedings Volume 4190, Optomechatronic Systems; (2001)
Event: Intelligent Systems and Smart Manufacturing, 2000, Boston, MA, United States
12 Ever since surface-mounting technology for printed circuit board (PCB) assembly processes has been developed, electrical products continuously tend toward the miniaturization of components, with denser packing of its boards. With the increasing necessity for reliable PCB product, there has been a considerable demand for high speed, high precision vision system to place the electric parts on PCB automatically. To recognize the electric parts with high accuracy and reliability, illumination condition is instrumental to acquisition of part images. In this paper, a versatile lighting is developed which utilizes three different types of illuminating methods: direct, indirect, and back-light illumination.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kuk Won Ko, Jae Wan Kim, Hyungsuck Cho, Ki Soo Jin, and Kwang Il Koh "Enhancement of placement accuracy for SMD via development of a new illumination system", Proc. SPIE 4190, Optomechatronic Systems, (12 February 2001);

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