Paper
24 October 2000 Empirical model of effective channel length (Leff) for 0.25-μm LDD nMOSFET
Po-Ching Liu, H. Lin
Author Affiliations +
Proceedings Volume 4228, Design, Modeling, and Simulation in Microelectronics; (2000) https://doi.org/10.1117/12.405419
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
xThe definition of effective channel length (Leff) is different from the metallurgical junction length (Lmet), or mask length (Lmask) for lightly-doped-drain (LDD) nMOS devices. Based on the measured data for 0.25 micrometers nMOSFET, an empirical expression on the deviation of effective channel resistance under GCA condition, namely VDS << VGS. BY measuring the channel resistance versus different mask lengths under differential variation of gate voltage VGS, and (Delta) Leff can be determined. The result predicts that under high gate voltage, a larger portion of gate overlapping region contributes to the conducing effective channel length.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Po-Ching Liu and H. Lin "Empirical model of effective channel length (Leff) for 0.25-μm LDD nMOSFET", Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); https://doi.org/10.1117/12.405419
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KEYWORDS
Resistance

Photomasks

Oxides

Transistors

Semiconducting wafers

Circuit switching

Field effect transistors

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