Paper
24 October 2000 Microcoil modeling: benefit and implementation of a permeable layer
Sven Rehfuss, Claudia Marschner, Dagmar Peters, Hilmar Bolte, Rainer Laur
Author Affiliations +
Proceedings Volume 4228, Design, Modeling, and Simulation in Microelectronics; (2000) https://doi.org/10.1117/12.405437
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
Rectangular micro coils which are used in a wide range of applications are the main components of appropriate wireless transmission systems for frequencies up to 20 MHz. As shown in previous works the self inductance of micro coils has to be maximized to achieve a higher working distance. This can be done by usage of a permeable layer underneath the micro coil. The existing model of the micro coil is extended by use of the magnetic image method to include the inductance yield caused by the permeable layer. The underlying permeable layer or substrate is also modeled accurately to include eddy current phenomena and parasitic elements. To do this the layer respectively the substrate is divided into segments analog to the structure of the micro coil. Each segment is described by lumped elements. All elements are connected together to build up a 3D network which will be used to calculate the terminal impedance. The model and first results will be presented.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sven Rehfuss, Claudia Marschner, Dagmar Peters, Hilmar Bolte, and Rainer Laur "Microcoil modeling: benefit and implementation of a permeable layer", Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); https://doi.org/10.1117/12.405437
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Inductance

Image segmentation

Oxides

3D modeling

Resistance

Chemical elements

Systems modeling

Back to Top