FEA evaluation on solder joint reliability of CCGA

Tim Fai Lam

doi:10.1117/12.404870

23 October 2000 FEA evaluation on solder joint reliability of CCGA

Tim Fai Lam

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404870
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

3D diagonal sliced models for seven combinations of CCGA packages were built. The FEA results show that, the board level reliability of package A with interposer is more than two times better than Package B without interposer. But the improvement should be mainly attributed to the bigger and longer columns used by Package A, instead of the interposer. Bigger and longer column and thicker eutectic joint improve the reliability significantly.

Citation Download Citation

Tim Fai Lam "FEA evaluation on solder joint reliability of CCGA", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404870

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