MEMS adhesive bond degradation sensor

Alan R. Wilson; Zouhair Sbiaa; Matt Hopcroft; Bernard C. Laskowski

doi:10.1117/12.418764

16 March 2001 MEMS adhesive bond degradation sensor

Alan R. Wilson, Zouhair Sbiaa, Matt Hopcroft, Bernard C. Laskowski

Proceedings Volume 4236, Smart Electronics and MEMS II; (2001) https://doi.org/10.1117/12.418764
Event: Smart Materials and MEMS, 2000, Melbourne, Australia

Abstract

The problem addressed in this paper is the through-life, non-destructive monitoring of corrosion and disbonding damages in airframes. The concept presented here is to produce a MEMS smart sensor consisting of a number of small, independent, wireless sensors within the structure of the aircraft. The MEMS smart sensor can be installed during repair and in particular when the specific platform goes through a complete tear down during the Life Extension Program (LEP). The sensors are permanently installed and can be permanently monitored and contain bond degradation sensing elements and CMOS circuits. Each sensor has an independent address and can perform measurements and communicate over a true 2-wire bus to an external interface unit. US ( 09/501,798) and international (PCT/US00/03308) patent applications have been lodged for this technology.

Citation Download Citation

Alan R. Wilson, Zouhair Sbiaa, Matt Hopcroft, and Bernard C. Laskowski "MEMS adhesive bond degradation sensor", Proc. SPIE 4236, Smart Electronics and MEMS II, (16 March 2001); https://doi.org/10.1117/12.418764

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