Paper
5 June 2001 Advanced defect-detection methods for CMP process modules in semiconductor manufacturing
J. Scott Steckenrider, Rick Foster, Sumit Guha, Younsoo Ra, Hawk Kim, Anantha Sethuraman
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Abstract
A comprehensive defect analysis scheme has been described here incorporating defect monitoring, classification and review tools. The integration scheme is presented pictorially, and described in detail in the body of this paper. This paper will also describe CMP defects gathered using this new defect detection methodology.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Scott Steckenrider, Rick Foster, Sumit Guha, Younsoo Ra, Hawk Kim, and Anantha Sethuraman "Advanced defect-detection methods for CMP process modules in semiconductor manufacturing", Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); https://doi.org/10.1117/12.429353
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KEYWORDS
Chemical mechanical planarization

Semiconducting wafers

Real-time computing

Scanning electron microscopy

Copper

Inspection

Defect detection

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