High-bandwidth low-power parallel optical interconnect using imaging fiber bundles and standard CMOS detectors

Cathleen Rooman; Paul L. Heremans; David Filkins; Reiner Windisch; Gustaaf Borghs; Roger A. Vounckx; Maarten Kuijk

doi:10.1117/12.428021

30 May 2001 High-bandwidth low-power parallel optical interconnect using imaging fiber bundles and standard CMOS detectors

Cathleen Rooman, Paul L. Heremans, David Filkins, Reiner Windisch, Gustaaf Borghs, Roger A. Vounckx, Maarten Kuijk

Author Affiliations +

Proceedings Volume 4292, Optoelectronic Interconnects VIII; (2001) https://doi.org/10.1117/12.428021
Event: Symposium on Integrated Optics, 2001, San Jose, CA, United States

Abstract

We present a high-bandwidth parallel optical link that operates from CMOS chip to CMOS chip, for applications like chip-to-chip, board-to-board and rack-to-rack interconnects. The optical channel is an oversampling imaging fiber bundle of 1.9 mm diameter. The light sources are a 10 X 10 2D array of high-speed, high-efficiency light-emitting diodes, design for flip-chip mounting onto CMOS driver circuits. Detectors and receivers are integrated together in standard CMOS, as an array of 10 X 10 detector/receiver cells.

Citation Download Citation

Cathleen Rooman, Paul L. Heremans, David Filkins, Reiner Windisch, Gustaaf Borghs, Roger A. Vounckx, and Maarten Kuijk "High-bandwidth low-power parallel optical interconnect using imaging fiber bundles and standard CMOS detectors", Proc. SPIE 4292, Optoelectronic Interconnects VIII, (30 May 2001); https://doi.org/10.1117/12.428021

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