Piezoelectric film sensor for measurement of peel stresses in bonded joints

Krishnakumar Shankar; Murat Tahtali; Richard Chester; Glen Torr

doi:10.1117/12.429603

13 June 2001 Piezoelectric film sensor for measurement of peel stresses in bonded joints

Krishnakumar Shankar, Murat Tahtali, Richard Chester, Glen Torr

Proceedings Volume 4317, Second International Conference on Experimental Mechanics; (2001) https://doi.org/10.1117/12.429603
Event: Second International Conference on Experimental Mechanics, 2000, Singapore, Singapore

Abstract

Adhesively bonded composite patches employed for repairing fatigue cracks in metallic airframe structural components often fail under peel stress generated in the structure. The application of piezoelectric stress sensors embedded within the bonded joint for direct measurement of the peel stresses is reported here. Polyvinylidine fluoride (PVDF) film of about 28 micron thickness coated with nickel copper is employed to construct hin sensors embedded between the composite patch and the metallic surface of the crotch joint specimen. PVDF sensor with varying sizes were constructed and calibrated using polycarbonate test specimens subjected to uniaxial tension and compression. The sensors were then embedded between the composite patch and the metallic surface of the crotch specimen to monitor the peel stresses in the adhesive. The measurements are compare with stresses in the adhesive. The measurements are compared with stresses predicted by finite element modeling.

Citation Download Citation

Krishnakumar Shankar, Murat Tahtali, Richard Chester, and Glen Torr "Piezoelectric film sensor for measurement of peel stresses in bonded joints", Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); https://doi.org/10.1117/12.429603

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