Progress of the EUVL alpha tool

Hans Meiling; Jos P.H. Benschop; Udo Dinger; Peter Kuerz

doi:10.1117/12.436675

20 August 2001 Progress of the EUVL alpha tool

Hans Meiling, Jos P.H. Benschop, Udo Dinger, Peter Kuerz

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Proceedings Volume 4343, Emerging Lithographic Technologies V; (2001) https://doi.org/10.1117/12.436675
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

After the successful completion of the European program EUCLIDES in which core competence for Extreme UltraViolet Lithography (EUVL) technology was generated, ASML (system integration), Carl Zeiss (optics), and their partners have entered the next phase of the program: design and realization of an exposure tool called the alpha tool ((alpha) -tool). This tool should be completed in 2003, and will demonstrate 50-nm-node compliant imaging using full- field all-reflective four-times reducing optics, as well as high performance vacuum scanning wafer- and reticle stages. IN this paper we present the status of the project, as well as highlight the progress in the optics development and optics contamination mitigation efforts.

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Hans Meiling, Jos P.H. Benschop, Udo Dinger, and Peter Kuerz "Progress of the EUVL alpha tool", Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); https://doi.org/10.1117/12.436675

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