Progress on the realization of the electron column modules for SCALPEL high-throughput/alpha electron projection lithography tools

Dirk Stenkamp; O. Kienzle; Alexander Orchowski; Wigbert D. Rau; A. Weickenmeier; G. Benner; M. Wetzke; Warren K. Waskiewicz; Victor Katsap; Xieqing Zhu; Haoning Liu; Eric Munro; John A. Rouse

doi:10.1117/12.436642

20 August 2001 Progress on the realization of the electron column modules for SCALPEL high-throughput/alpha electron projection lithography tools

Dirk Stenkamp, O. Kienzle, Alexander Orchowski, Wigbert D. Rau, A. Weickenmeier, G. Benner, M. Wetzke, Warren K. Waskiewicz, Victor Katsap, Xieqing Zhu, Haoning Liu, Eric Munro, John A. Rouse

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Proceedings Volume 4343, Emerging Lithographic Technologies V; (2001) https://doi.org/10.1117/12.436642
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

With the production of the first High-Throughput Alpha Tools, Electron Beam Projection Lithography (EPL) is entering the commercialization phase. Here, we report on the realization of the electron column modules for the SCALPEL HT/Alpha EPL systems, designed to demonstrate high wafer throughput at resolutions at and below 100 nm. We describe our highly modular setup of each electron optical component targeted at maximum flexibility and enabling a fast and smooth evolution towards higher throughput and resolution. By applying strict design and process rules we were able to set-up the complete production flow from the design, construction and manufacturing of the components of the ferrite/dielectric deflector based projection optics up to established qualification schemes within less than one year. A crucial point for the overall tool performance is the timely availability of system alignment and metrology strategies. Here we adapt state-of-the-art techniques from light optical lens manufacturing to a maximum amount. We discuss our metrology and alignment approach based on aerial image analysis combined with extensive electron optical imaging simulations and present first theoretical and experimental sub-100 nm results.

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Dirk Stenkamp, O. Kienzle, Alexander Orchowski, Wigbert D. Rau, A. Weickenmeier, G. Benner, M. Wetzke, Warren K. Waskiewicz, Victor Katsap, Xieqing Zhu, Haoning Liu, Eric Munro, and John A. Rouse "Progress on the realization of the electron column modules for SCALPEL high-throughput/alpha electron projection lithography tools", Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); https://doi.org/10.1117/12.436642

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KEYWORDS

Charged-particle lithography

Photomasks

Optics manufacturing

Projection systems

Optical alignment

Metrology

Semiconducting wafers

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