Paper
14 September 2001 ArF imaging modeling by using resist simulation and pattern matching
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Abstract
This paper presents a methodology for calibrating projection printing imaging/resist models and applying the calibrated models to line-end shortening simulations in the presence of image imperfections. A scheme for extracting monochromatic representations of resist patterns from SEM pictures and comparing them with simulated images is presented. Based on this scheme, a 2-dimensional metric for evaluating the simulation performance is defined and a framework for tuning simulation models is built. The experiments were conducted on a 193nm scanner, with a binary mask whose CD's were measured to eliminate the mask error effects. Comparison of the simulated resist patterns to the SEM micrographs allows evaluation of various levels of physical assumptions on simulation models over the defocus range. Several models were evaluated to quantify the impact of lens aberrations and resist characters on pattern fidelity. Then the effectiveness of these models was further validated by applying the models to simulate small patterns. Aberration effects were found to be very distinctive and a tuned resist modeling was also found to be essential for small features.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mosong Cheng and Andrew R. Neureuther "ArF imaging modeling by using resist simulation and pattern matching", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); https://doi.org/10.1117/12.435731
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CITATIONS
Cited by 2 scholarly publications and 3 patents.
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KEYWORDS
Scanning electron microscopy

Lithography

Performance modeling

Calibration

Distortion

Photomasks

Device simulation

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