Evaluation of new mask materials for improved lithography performance

Bryan S. Kasprowicz; Richard Priestley

doi:10.1117/12.435782

Translator Disclaimer

14 September 2001 Evaluation of new mask materials for improved lithography performance

Bryan S. Kasprowicz, Richard Priestley

Author Affiliations +

Proceedings Volume 4346, Optical Microlithography XIV; (2001) https://doi.org/10.1117/12.435782
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

Mask materials are the often-overlooked link in the lithography chain. Chipmakers in general, have no idea of the optical properties of the mask substrate material that is being used to build his critical layer mask. By analyzing properties such as stress birefringence, transmission uniformity, index of refraction homogeneity, and certain laser damage properties it was found that a wide variation exists within the available population of mask substrate materials. Testing the impact of materials on a lithography tool demonstrated the wide range of performance that can be obtained from a population of mask substrates. For example, dose to clear tests gave results that ranged from 3.15mJ/cm2 to 3.25mJ/cm2 with dose non-uniformity ranging from 2.00% to 5.25%. This paper will discuss the tests that were made and the results to date. Due diligence on the selection of material substrates is required.

Citation Download Citation

Bryan S. Kasprowicz and Richard Priestley "Evaluation of new mask materials for improved lithography performance", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); https://doi.org/10.1117/12.435782

ACCESS THE FULL ARTICLE