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23 October 2001 Microphotogrammetry for 3D strain measurement and microassembly control
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Proceedings Volume 4400, Microsystems Engineering: Metrology and Inspection; (2001) https://doi.org/10.1117/12.445602
Event: Lasers in Metrology and Art Conservation, 2001, Munich, Germany
Abstract
In photogrammetry several images of an object taken from different positions in space, are combined to calculate 3D geometrical data. This concept can be scaled down to dimensions in the mm or sub-mm regime. In this paper the application of microphotogrammetry for the measurement of strain fields in material testing is presented. The working principle and an experimental measurement setup are described and results of two application examples are given. Microphotogrammetry is compared with speckle-interferometry as an alternative approach for strain field measurement. As an additional implementation of the microphotogrammetric approach the current state of development of a precision assembly system with a positioning control using CCD-cameras is discussed.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rainer Tutsch, Reinhold Ritter, Diana Ispas, Marcus Petz, and Leobaldo Casarotto "Microphotogrammetry for 3D strain measurement and microassembly control", Proc. SPIE 4400, Microsystems Engineering: Metrology and Inspection, (23 October 2001); https://doi.org/10.1117/12.445602
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