Adapted time power profile for laser beam soldering with solder paste

Luedger Bosse; Arnold Gillner; Reinhart Poprawe

doi:10.1117/12.425260

23 April 2001 Adapted time power profile for laser beam soldering with solder paste

Luedger Bosse, Arnold Gillner, Reinhart Poprawe

Proceedings Volume 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II; (2001) https://doi.org/10.1117/12.425260
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

Today laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology. However due to the onwardly going miniaturization and the world-wide trend towards lead-free solders LBS gains more attention for certain applications in this field. In mass-production, e.g. in interconnection technology of electronic devices, it is state-of-the-art to use solder alloys in the form of paste. Today it is a well- known process to handle or to deposit solder paste. Furthermore the composition of solder systems, consisting of metal alloys and fluxes, can be optimized for individual products and production conditions. Yet this optimization process is only in part performed for LBS with solder paste. Therefore the application of standard reflow solder pastes for LBS poses problems like gas eruptions, solder balling and overheating. In order to overcome these quality problems an adapted time-power-profile for LBS with solder paste has been developed, using synchronized high-speed photography and detection of secondary emissions from the joining area. The evaluation of the experiments allows the generation of high quality solder joints with standard diode laser systems and solder pastes. In addition it is possible to realize an online-process control via detecting the secondary emissions from the subsequent transformation stages of the solder paste. Conclusively it can be said LBS is a stable, reproducible process for applications requiring a controlled locally limited heat input and reduced thermal and mechanical stress compared to conventional techniques.

Citation Download Citation

Luedger Bosse, Arnold Gillner, and Reinhart Poprawe "Adapted time power profile for laser beam soldering with solder paste", Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); https://doi.org/10.1117/12.425260

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available