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30 April 2001 Modeling and simulation of a silicon microdiaphragm piezoresistive pressure sensor using finite element analysis (FEA) tools
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Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425318
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
Abstract
In this paper, diaphragm deflection and output voltage obtained by applying a series of pressure loads to a silicon piezoresistive micro-diaphragm with built-in edges are presented. A silicon pressure sensor with diaphragm of 1 mm in length and 10 mm in thickness is modelled. Finite Element Analysis results are compare with other experimental and numerical results. A series of simulation on sensor with diaphragm of 3.4-mm in length and various thicknesses, meshing densities and resistor lengths is performed. Discussion of results are based upon (1) effect of different resistor lengths on output voltage and sensitivity and (2) effect of different diaphragm thicknesses on output are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. J. Pang and Marc P.Y. Desmulliez "Modeling and simulation of a silicon microdiaphragm piezoresistive pressure sensor using finite element analysis (FEA) tools", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425318
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