Wafer scale packaging for a MEMS video scanner

Mark P. Helsel; Jon Barger; David W. Wine; Thor D. Osborn

doi:10.1117/12.425304

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30 April 2001 Wafer scale packaging for a MEMS video scanner

Mark P. Helsel, Jon Barger, David W. Wine, Thor D. Osborn

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Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425304
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

Miniaturized scanners have proven their usefulness in a host of applications including video display, bar code reading, image capture, laser printing and optical switching. In order for these applications to reach fruition, however, the MEMS scanner component must be packaged in a manner that is compatible with the volume manufacturing capabilities of the technology. This paper describes a process that was developed to package an SVGA resolution (800 X 600) biaxial video scanner. The scanner is designed for a head mounted display product, targeted to the medical and industrial markets. The scanner is driven magnetically on one axis and capacitively on the other axis. The first level wafer scale package described here incorporates the capacitive drive electrodes into the mounting substrate. The substrate wafer and the device wafer are then bonded using a glass frit sealing technique. Finally, the scanner and substrate are hermetically sealed into a metal can at reduced pressure.

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Mark P. Helsel, Jon Barger, David W. Wine, and Thor D. Osborn "Wafer scale packaging for a MEMS video scanner", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425304

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