Pattern shape analysis tool for quantitative estimate of photomask and process

Isao Yonekura; Yuhichi Fukushima; Fuyuhiko Matsuo; Masao Otaki; Norihito Fukugami

doi:10.1117/12.438360

5 September 2001 Pattern shape analysis tool for quantitative estimate of photomask and process

Isao Yonekura, Yuhichi Fukushima, Fuyuhiko Matsuo, Masao Otaki, Norihito Fukugami

Author Affiliations +

Proceedings Volume 4409, Photomask and Next-Generation Lithography Mask Technology VIII; (2001) https://doi.org/10.1117/12.438360
Event: Photomask and Next Generation Lithography Mask Technology VIII, 2001, Kanagawa, Japan

Abstract

We developed a pattern shape analysis tool (MaskEXPRESS) which can evaluate quantitatively photomask pattern and fabrication process by means of image processing arising from CD-SEM or UV microscope, or inspection machine. Although evaluation of complicated mask pattern has been performed qualitatively as yet, MaskEXPRESS makes it possible to evaluate it quantitatively. MaskEXPRESS can also be applied to quantitative evaluation of sensitivity of inspection machine, accuracy of EB writing, and optimization of photomask fabrication process. This paper describes the outline of MaskEXPRESS and its functions. We investigated about the precision criteria of MaskEXPRESS and found out the conditions of image processing for having accuracy equal to repeatability accuracy of measurement SEM. By changing experimentally mask fabrication conditions and analyzing the patterns, the following things became clear. Hole pattern's area increase with keeping analogous shape as etching time increases. Inner serif pattern tends to change in the direction of slant as writing dose increases. The rectangle fidelity of inner and outer serif pattern is improved according to the condition of resist process. We also present the relationship between defect size and aerial image on wafer simulated utilizing MaskEXPRESS.

Citation Download Citation

Isao Yonekura, Yuhichi Fukushima, Fuyuhiko Matsuo, Masao Otaki, and Norihito Fukugami "Pattern shape analysis tool for quantitative estimate of photomask and process", Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); https://doi.org/10.1117/12.438360

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE