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25 February 2002 Dynamic particle removal by nanosecond dry laser cleaning: theory
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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456828
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
A model for ns dry laser cleaning that treats the substrate and particle expansion on a unified basis is suggested. Formulas for the time-dependent thermal expansion of the substrate, valid for temperature-dependent parameters are derived. Van der Waals adhesion, the elasticity of the substrate and particle, as well as particle inertia is taken into account for an arbitrary temporal profile of the laser pulse. Time scale related to the size of the particles and the adhesion/elastic constants is revealed. Cleaning proceeds in different regimes if the duration of the laser pulse is much shorter/longer than this characteristic time. Expressions for cleaning thresholds are provided and compared with experiments on the cleaning of Si surfaces from spherical SiO2 particles with radii between 200 and 2585 nm in vacuum with 248 nm KrF excimer laser and 532 nm frequency doubled Nd-YAG laser. Large discrepancies between the experimental data and theoretical results for KrF laser suggest that ns dry laser cleaning cannot be explained on the basis of thermal expansion mechanism alone.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nikita Arnold, G. Schrems, T. Muehlberger, M. Bertsch, Mario Mosbacher, Paul Leiderer, and Dieter Baeuerle "Dynamic particle removal by nanosecond dry laser cleaning: theory", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); https://doi.org/10.1117/12.456828
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