Laser marking on IC package by micro-encapsulated tapes

Kaidong D. Ye; Chengwu An; Yuan Yuan; Yongfeng Lu

doi:10.1117/12.456892

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25 February 2002 Laser marking on IC package by micro-encapsulated tapes

Kaidong D. Ye, Chengwu An, Yuan Yuan, Yongfeng Lu

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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456892
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore

Abstract

In this paper, we are reporting a new way to do marking on IC package. In this way, white ink is wrapped in microcapsules that are coated on a transparent tape. Laser is irradiated on the tape surface, the microcapsules are broken and the ink is released onto the IC package surface. After an UV light treatment, the ink will stick on the IC surface, forming a high contrast marking. It is found that the quality of the marking depends on tape configuration, tape-IC distance, laser peak power, scan speed of laser irradiation and other laser parameters.

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Kaidong D. Ye, Chengwu An, Yuan Yuan, and Yongfeng Lu "Laser marking on IC package by micro-encapsulated tapes", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); https://doi.org/10.1117/12.456892

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