Laser reflow plastic ball grid array

DaMing Liu; Tao Chen; Yuan Yuan; Yongfeng Lu; Minghui Hong; Ryan J. K. Goh

doi:10.1117/12.456834

Translator Disclaimer

25 February 2002 Laser reflow plastic ball grid array

DaMing Liu, Tao Chen, Yuan Yuan, Yongfeng Lu, Minghui Hong, Ryan J. K. Goh

Author Affiliations +

Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456834
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore

Abstract

A modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 micrometers and Au-Ni-Cu solder pads are used in the study. Shear strength tests are preformed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 micrometers Sn-Pb eutectic solder balls is proposed.

Citation Download Citation

DaMing Liu, Tao Chen, Yuan Yuan, Yongfeng Lu, Minghui Hong, and Ryan J. K. Goh "Laser reflow plastic ball grid array", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); https://doi.org/10.1117/12.456834

ACCESS THE FULL ARTICLE