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This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10-6 grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning adhesives from near 1 percent to less than 0.1 percent with fractional, percentage movements over thermal range of -40 degrees C to +200 degrees C.
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Andy Bachmann, "Advances in light curing adhesives," Proc. SPIE 4444, Optomechanical Design and Engineering 2001, (5 November 2001); https://doi.org/10.1117/12.447301