Translator Disclaimer
Paper
28 September 2001 Integrated cavity wafer level chip size package for MEMS applications
Author Affiliations +
Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442942
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
The packaging of microelectromechanical devices is currently one of the most challenging in this emerging field. The available packaging technologies often provide large dimensions and expensive solutions, thereby limiting the market penetration of micro electromechanical devices. A wafer level chip scale package (WLCSP) with an integrated cavity above the active area of the device for microelectromechanical components is described. This WLCSP is designed for devices with mechanically moving components such as micromirrors, miniature gyroscopes, acceleration detectors, etc.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Danny Weiss, Doron Teomim, Avner P. Badihi, and Gil Zilber "Integrated cavity wafer level chip size package for MEMS applications", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442942
PROCEEDINGS
9 PAGES


SHARE
Advertisement
Advertisement
Back to Top