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28 September 2001 Multilevel microstructures and mold inserts fabricated with planar and oblique x-ray lithography of SU-8 negative photoresist
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Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442979
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
For patterning thick photoresist films, x-ray lithography is superior to optical lithography because of the use of a shorter wavelength and a very large depth of focus. SU-8 negative resist is well suited to pattern tall, high-aspect ratio microstructures in UV optical and x-ray lithography with rapid prototyping capability due to its high sensitivity. The negative tone of the SU-8 resist offers advantages in fabricating multi-level and non-planar microstructures using x-ray lithography or a combination of x-ray and UV optical lithography. In this paper, we present a fabrication process for multi-level metallic mold insert by a combination of multi-layer SU-8 patterning, poly-dimethylsiloxane (PDMS) molding, and nickel electroplating to make final nickel mold inserts that are suitable for injection molding and hot embossing of plastics and ceramics.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Linke Jian, Yohannes M. Desta, and Jost Goettert "Multilevel microstructures and mold inserts fabricated with planar and oblique x-ray lithography of SU-8 negative photoresist", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442979
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