Progress on 300-mm wafer lithography equipment and processes

Karl E. Mautz; John G. Maltabes

doi:10.1117/12.442959

28 September 2001 Progress on 300-mm wafer lithography equipment and processes

Karl E. Mautz, John G. Maltabes

Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442959
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

SEMICONDUCTOR300 was the first pilot-production facility for 300mm wafers in the world. The company, a joint venture between Motorola, Inc. and Infineon Technologies started in early 1998 to test and compare process, metrology and probe equipment, develop robust processes, and manufacture products using a 300mm wafer tool set. The lithography tools included I-line steppers, an I-line scanner, a DUV stepper, and DUV scanners. All of these exposure tools were running in-line with various photoresist coat and develop tracks. The lithography tools were used to build both 64M and 256M DRAM devices and aggressive test vehicles. The process capability of the initial 0.25 micrometers reference process was done and compared to the 200mm data set of the sister factory. Automation issues for lithography tools were addressed and the cost metrics were calculated. SC300 demonstrated that a manufacturable 300mm lithography tool set and process for various ground rule devices was possible with the required performance in image transfer, CD control, and overlay. Further testing on 0.18micrometers and 0.15micrometers ground rule features indicated a sufficient process window for potential manufacturing. Additionally, it was demonstrated that non-concentric subfield stepping was feasible.

Citation Download Citation

Karl E. Mautz and John G. Maltabes "Progress on 300-mm wafer lithography equipment and processes", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442959

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
13 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Semiconducting wafers

Scanners

Lithography

Deep ultraviolet

Optical alignment

Critical dimension metrology

Overlay metrology

Show All Keywords

Keywords/Phrases

Search In:

Publication Years