Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings

Melissa V. Collins; Lauren E. S. Rohwer; Andrew D. Oliver; Matthew G. Hankins; Deidre A. Hirschfeld

doi:10.1117/12.443007

2 October 2001 Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings

Melissa V. Collins, Lauren E. S. Rohwer, Andrew D. Oliver, Matthew G. Hankins, Deidre A. Hirschfeld

Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443007
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

This work describes full wafer encapsulation of released, self-assembled monolayer (SAM) coated, multi-level polysilicon surface micromachines using the anodic bonding technique. This process has been utilized to protect fragile surface micromachines from damage due to particles, moisture contamination, and post-release die handling. The anodic bonding process was optimized to ensure strong glass-to-wafer bonds, while maintaining the effectiveness of liquid-phase and vapor-phase deposited SAM coatings. The temperature, time, and voltage effects on each SAM coating was analyzed. Glass-to-silicon and glass-to-SAM coated silicon had shear strengths of approximately 18 MPa. Glass-to-polysilicon bonds had lower shear strengths of approximately 10 MPa. Bonds were hermetic to 5 X 10^-8 atm-cm³/s.

Citation Download Citation

Melissa V. Collins, Lauren E. S. Rohwer, Andrew D. Oliver, Matthew G. Hankins, and Deidre A. Hirschfeld "Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); https://doi.org/10.1117/12.443007

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