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1 October 2001 Novel MEMS devices and silicon micromachined components for high-frequency circuits
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Abstract
This paper discusses recent developments in MEMS devices and Si-micromachined circuits. Specifically, the issue of poor isolation in individual MEMS switches is addressed in the context on creative designs that lead to the development of very-high isolation MEMS switch architectures operating in a very broad frequency range. Furthermore, Si-micromachined circuits appropriate for use in modern communications systems are described, and novel K- thru W-band 3D multi- layer architectures are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Linda P.B. Katehi "Novel MEMS devices and silicon micromachined components for high-frequency circuits", Proc. SPIE 4559, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication, (1 October 2001); https://doi.org/10.1117/12.443041
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