Impact on wafer process of sub-120-nm design rule mask

Young-Mog Ham; Sang-Sool Koo; Sang Jin Kim; Won-Kwang Ma; Ki-Soo Shin

doi:10.1117/12.458258

11 March 2002 Impact on wafer process of sub-120-nm design rule mask

Young-Mog Ham, Sang-Sool Koo, Sang Jin Kim, Won-Kwang Ma, Ki-Soo Shin

Author Affiliations +

Proceedings Volume 4562, 21st Annual BACUS Symposium on Photomask Technology; (2002) https://doi.org/10.1117/12.458258
Event: Photomask 2001, 2001, Monterey, CA, United States

Abstract

Optical lithography makes various problems in the low k₁ range due to high MEF and low process margin. This has an impact upon CD variation, pattern collapse, pattern thinning, and undesirable repeating defect throughout the wafer process. Moreover, it is difficult to understand main factor that affected process problems. In this paper, mainly we study impacts on wafer process using 120nm design rule mask. Experimentally, w use full field mask composed of DRAM structure with cell array and periphery patterns. 0.70 NA KrF exposure tool and APSM are used to get high process margin and good pattern fidelity. As a result, we got about 10 percent EL and 0.5 micrometers DOF or more in actual process. Also CD variation was controlled within 15nm using CMP and BARC. However, mask CD variation was amplified on wafer, especially wafer CD variation was very serious in the edge of cell array by optical proximity effect, stand wave effect, and mask. Patterning and etching process occurred line thinning, and it was inspected as repeating defect. TO get optimum process result, it was very important to control mask CD and wafer CD within process window after mask CD correlation. We could find that mask or wafer process have an influence on unexpected problem for 120nm process with low k₁ value.

Citation Download Citation

Young-Mog Ham, Sang-Sool Koo, Sang Jin Kim, Won-Kwang Ma, and Ki-Soo Shin "Impact on wafer process of sub-120-nm design rule mask", Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458258

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
11 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Photomasks

Critical dimension metrology

Semiconducting wafers

Lithography

Mask making

Optical lithography

Optical proximity correction

Show All Keywords

Keywords/Phrases

Search In:

Publication Years