Paper
21 November 2001 MEMS sensor packaging using LTCC substrate technology
Harri K. Kopola, Jaakko Lenkkeri, Kari Kautio, Altti Torkkeli, Outi Rusanen, Tuomo Jaakola
Author Affiliations +
Proceedings Volume 4592, Device and Process Technologies for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.448960
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia
Abstract
Low Temperature Cofired Ceramic (LTCC) material can be used as a reliable multilayer substrate material for silicon based MEMS component packaging due to many benefits like hermeticity, good match of thermal expansion coefficient (TCE) to silicon to minimise packaging-induced thermomechanical stresses, and the possibility to make cavities into the structure. The applicability of LTCC technologies for MEMS packaging is described in this paper. A review of the technologies used in making LTCC modules, such as substrate manufacturing, interconnecting, sealing and protection, and the benefits of LTCC for MEMS packaging is presented. Also examples on the use of LTCC technology for MEMS sensor packaging are discussed.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harri K. Kopola, Jaakko Lenkkeri, Kari Kautio, Altti Torkkeli, Outi Rusanen, and Tuomo Jaakola "MEMS sensor packaging using LTCC substrate technology", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); https://doi.org/10.1117/12.448960
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Cited by 12 scholarly publications and 1 patent.
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KEYWORDS
Microelectromechanical systems

Packaging

Silicon

Sensors

Ceramics

Manufacturing

Electronics

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