Microfabrication of hemispherical polysilicon shells standing on hemispherical cavities

Cheng-Hsuan Lin; Yi-Chung Lo; Wensyang Hsu

doi:10.1117/12.449010

21 November 2001 Microfabrication of hemispherical polysilicon shells standing on hemispherical cavities

Cheng-Hsuan Lin, Yi-Chung Lo, Wensyang Hsu

Proceedings Volume 4592, Device and Process Technologies for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.449010
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia

Abstract

In the current paper, the fabrication process of a novel proposed hemispherical polysilicon shell standing on a hemispherical silicon cavity is demonstrated. This micro-fabrication process combines both bulk and surface micromachining, which include the isotropic wet etching, a novel mask design, the thick photo resist coating and exposure, and high-aspect-ratio curved sacrificial technique. In isotropic wet etching of a hemispherical cavity, the optimal concentration of etchant is experimentally determined along with adequate ultrasonic vibration during wet etching to produce the circle-like of hemispherical cavity. The conventional alignment mark, which will be destroyed during the rather long isotropic wet etching process, is replaced by a novel mask design with the second alignment mark. Also, for a deep hemispherical cavity larger than 100úgm, the traditional photo resist can not be coated on the corner surface well. The thick photo resist, AZ4620, is found to be able to overcome this problem and be successfully exposed all through its bottom surface. Furthermore, the deposited sacrificial layer materials (PSG) on this cavity will usually result in thinner layer near the corner. In addition, the curved gap of PSG layer has the feature with high-aspect-ratio. These make the PSG etching difficult. Therefore, two steps etching process with two different hydrofluoric concentrations are used to release the PSG with 2micrometers thickness and 150micrometers arc length.

Citation Download Citation

Cheng-Hsuan Lin, Yi-Chung Lo, and Wensyang Hsu "Microfabrication of hemispherical polysilicon shells standing on hemispherical cavities", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); https://doi.org/10.1117/12.449010

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