uEDM-produced mechanical grippers for handling and assembly in microtechnology

Dragan Petrovic; Gordana Popovic; Elias Chatzitheodoridis; Oscar Del Medico; Ana Almansa; Franz Suemecz; Peter Herbst; Werner Brenner; Helmut Detter; Roland Duffait

doi:10.1117/12.448963

21 November 2001 μEDM-produced mechanical grippers for handling and assembly in microtechnology

Dragan Petrovic, Gordana Popovic, Elias Chatzitheodoridis, Oscar Del Medico, Ana Almansa, Franz Suemecz, Peter Herbst, Werner Brenner, Helmut Detter, Roland Duffait

Author Affiliations +

Proceedings Volume 4592, Device and Process Technologies for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.448963
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia

Abstract

Two mechanical gripper types have been designed. Using a technology selection method, EDM was selected as the most appropriate fabrication technology for the designed grippers. Prototypes have been fabricated by wire EDM on a conventional machine. Increased attention has been paid to methodology of the production process and exploration of (mu) -EDM possibilities. The tolerance obtained is about 1 micrometers . The accuracy of the machined product is mainly determined by the quality of the electrode, its handling and the adjustment procedures. After fabrication the grippers were integrated onto a station for handling and assembly of microstructures. This paper provides a description of the used methodology in the production sequence and information on the machining process of the whole gripping system (gripper, holder, arrow). The results after the production are tested, analyzed and discussed.

Citation Download Citation

Dragan Petrovic, Gordana Popovic, Elias Chatzitheodoridis, Oscar Del Medico, Ana Almansa, Franz Suemecz, Peter Herbst, Werner Brenner, Helmut Detter, and Roland Duffait "μEDM-produced mechanical grippers for handling and assembly in microtechnology", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); https://doi.org/10.1117/12.448963

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
11 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Electrodes

Surface finishing

Image quality

Scanning electron microscopy

Bridges

Microtechnology

Surface roughness

Show All Keywords

Keywords/Phrases

Search In:

Publication Years