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30 October 2001 Characterization of electronic packaging materials and components by image correlation methods
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Proceedings Volume 4596, Advanced Photonic Sensors and Applications II; (2001)
Event: International Symposium on Photonics and Applications, 2001, Singapore, Singapore
Recent advances in micro electronics and electronic packaging have led to a strong need in material characterization on micro and nano scale. The authors present an approach to deformation measurement based on localized correlation analysis on load state images. Displacement and strain fields are extracted from images, captured by high resolution equipment, e.g. by optical far distance, scanning electron and scanning force microscopes. As a result object response to mechanical or thermal load can be recorded from microscopic or nanoscopic material areas. Within the paper a brief overview is given about measurement basics, achievable measurement resolution and equipment. The method is being applied to thermo-mechanical reliability studies on electronic packaging components. As an example stress suppression mechanisms on advanced chip scale packages (CSP) have been investigated. Spatially resolved deformation measurement by correlation techniques could have been extended successfully to AFM imaging. A corresponding application is demonstrated for experiments on microcrack evaluation. In order to measure material properties a modified correlation algorithm is applied assuming homogeneous material response. Determining average strains over micrographs material properties as coefficients of thermal expansion (CTE) and Poisson ratios can be determined on micro objects.
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Dietmar Vogel, Juergen Auersperg, and Bernd Michel "Characterization of electronic packaging materials and components by image correlation methods", Proc. SPIE 4596, Advanced Photonic Sensors and Applications II, (30 October 2001);

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