Crack-free laser processing of glass substrate and its mechanisms

Ming Hui Hong; Koji Sugioka; Ding Jiang Wu; L. L. Wong; Yongfeng Lu; Katsumi Midorikawa; Tow Chong Chong

doi:10.1117/12.470632

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18 June 2002 Crack-free laser processing of glass substrate and its mechanisms

Ming Hui Hong, Koji Sugioka, Ding Jiang Wu, L. L. Wong, Yongfeng Lu, Katsumi Midorikawa, Tow Chong Chong

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Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470632
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

Laser-induced -plasma-assisted ablation for crack-free laser processing of glass substrate is investigated. Different form laser breakdown at high laser fluence, a pulsed green laser is used to achieve the glass processing in air at much lower laser fluence. Laser beam goes though eh substrate first and then irradiates on a solid target behind. For laser fluence above target ablation threshold, plasma generated from target behind. For laser fluence above target ablation threshold, plasma generated from target ablation flies forward at a high speed. At a small target-to- substrate distance, there are strong interactions among laser light, target plasma and glass substrate at its rear side surface. With the target materials deposition on the glass surface or even doping into the glass substrate, light absorption characteristic at the near side surface is modified. The laser processing result is closely related to target-to-substrate distance, laser scanning speed and its repetition rate. Color marking, glass metalization and structuring can be achieved with the fine tune of the laser processing parameters.

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Ming Hui Hong, Koji Sugioka, Ding Jiang Wu, L. L. Wong, Yongfeng Lu, Katsumi Midorikawa, and Tow Chong Chong "Crack-free laser processing of glass substrate and its mechanisms", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470632

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