Laser applications in integrated circuit packaging

Yongfeng Lu; Wen Dong Song; ZhongMin Ren; Chengwu An; Kaidong D. Ye; DaMing Liu; Weijie Wang; Ming Hui Hong; Tow Chong Chong

doi:10.1117/12.470667

18 June 2002 Laser applications in integrated circuit packaging

Yongfeng Lu, Wen Dong Song, ZhongMin Ren, Chengwu An, Kaidong D. Ye, DaMing Liu, Weijie Wang, Ming Hui Hong, Tow Chong Chong

Author Affiliations +

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470667
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash form heat sinks and lead wires of IC packages, laser singulation of BGA and CSP, laser reflow of solder ball on GBA, laser marking on packages and on SI wafers. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to b taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications.

Citation Download Citation

Yongfeng Lu, Wen Dong Song, ZhongMin Ren, Chengwu An, Kaidong D. Ye, DaMing Liu, Weijie Wang, Ming Hui Hong, and Tow Chong Chong "Laser applications in integrated circuit packaging", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470667

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