Microscale bending of brittle materials using pulsed and CW lasers

X. Richard Zhang; Xianfan Xu

doi:10.1117/12.470635

18 June 2002 Microscale bending of brittle materials using pulsed and CW lasers

X. Richard Zhang, Xianfan Xu

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470635
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

This work demonstrated using pulsed and CW lasers for microscale bending of brittle materials, including glass, ceramic, and silicon. Based on the absorption characteristics of these materials, different types of laser were used for achieving bending. Experimental studies were conducted to find out relations between bending angles and laser operation parameters.

Citation Download Citation

X. Richard Zhang and Xianfan Xu "Microscale bending of brittle materials using pulsed and CW lasers", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470635

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