Translator Disclaimer
21 May 2002 Novel germanium photodetectors fabricated with a diffused junction
Author Affiliations +
Proceedings Volume 4650, Photodetector Materials and Devices VII; (2002)
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States
Germanium (Ge) photodetectors are fabricated by growing epitaxial III-V compounds on Ge substrates and by in-situ formation of the PN junction by MOVPE. After material growth, Ge photodetectors are mesa-etched using conventional optoelectronic device processing techniques. By varying the Ge substrate resistivity and the device area, Ge photodetector properties such as reverse leakage current, capacitance, and shunt resistance have been engineered. Such devices have demonstrated leakage currents below 50(mu) A/cm2 at -0.1 V bias. For optoelectronic applications that require high temperature operation, high shunt resistance detectors exhibit leakage currents below (mu) A/cm2 at 80 degree(s)C. Low capacitance devices have measured as little as 275 pF at 0V bias for a 1 mm diameter detector. High shunt resistance devices are a low cost alternative to conventional InGaAs photodiodes in applications such as laser monitor diodes.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Charles B. Morrison, Rengarajan Sudharsanan, Moran Haddad, Joseph C. Boisvert, Dmitri D. Krut, Richard R. King, and Nasser H. Karam "Novel germanium photodetectors fabricated with a diffused junction", Proc. SPIE 4650, Photodetector Materials and Devices VII, (21 May 2002);

Back to Top