Paper
16 July 2002 Determination of DICD best focus by top-down CD-SEM
Wenzhan Zhou, Hui Kow Lim, Teng Hwee Ng
Author Affiliations +
Abstract
As critical-dimension shrink below 0.18 micrometers , the SPC (Statistical Process Control) based CD (Critical Dimension) control in lithography process becomes more difficult. Increasing requirements of a shrinking process window have called on the need for more accurate decision of process window center. However in practical fabrication, we found that top-down CD-SEM showed its limitations in process window center determination, especially for the best focus. For instance, in some extreme focus situation, resist pattern will show a severe undercutting profile which will affect the DICD reading by top-down CD-SEM with fixed measurement algorithm. This kind of DICD measurement error will finally affect the process window center determination (especially best focus) and in-line DICD monitoring, which will lead to the cost of scrap and loss of time for trouble-shooting. In this paper, we will present a detailed study of DICD best focus determination in case of top-down DICD by experiment and simulation. Further a possible solution to this problem will be described in the latter part of this paper.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wenzhan Zhou, Hui Kow Lim, and Teng Hwee Ng "Determination of DICD best focus by top-down CD-SEM", Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); https://doi.org/10.1117/12.473451
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Cited by 1 scholarly publication and 1 patent.
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KEYWORDS
Critical dimension metrology

Process control

Scanning electron microscopy

Absorption

Photomasks

Metrology

Cadmium

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