Die-scale wafer flatness: 3D imaging across 20 mm with nanometer-scale resolution

Kirk Miller; David H. Fong; Dean J. Dawson; Bradley Todd

doi:10.1117/12.473527

16 July 2002 Die-scale wafer flatness: 3D imaging across 20 mm with nanometer-scale resolution

Kirk Miller, David H. Fong, Dean J. Dawson, Bradley Todd

Proceedings Volume 4689, Metrology, Inspection, and Process Control for Microlithography XVI; (2002) https://doi.org/10.1117/12.473527
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

We present 3-dimensional atomic force profiler (AFP) measurements on die-scale flatness after copper and STI CMP. True metrology is achieved for patterned wafers. Wafers are vacuum-mounted on a flat chuck, as they would be in a stepper, so wafer warpage and strain-related non-planarity are not present. The results of this new technique are compared against current measurement techniques. For logic, memory and System-on-a-chip, we discuss the implications of wafer planarity going into subsequent photolithography steps.

Citation Download Citation

Kirk Miller, David H. Fong, Dean J. Dawson, and Bradley Todd "Die-scale wafer flatness: 3D imaging across 20 mm with nanometer-scale resolution", Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); https://doi.org/10.1117/12.473527

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available