Metal characterization and process enhancement techniques for photolithographic materials

Fu-Hsiang Ko; Hsuen-Li Chen; Chun-Chen Hsu; Tieh-Chi Chu

doi:10.1117/12.473512

16 July 2002 Metal characterization and process enhancement techniques for photolithographic materials

Fu-Hsiang Ko, Hsuen-Li Chen, Chun-Chen Hsu, Tieh-Chi Chu

Proceedings Volume 4689, Metrology, Inspection, and Process Control for Microlithography XVI; (2002) https://doi.org/10.1117/12.473512
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

A high-throughput, one-step microwave technique was developed for the dissolution of photolithographic materials. The effects of dissolution temperature and digestion acid volume on the dissolution efficiency were systematically evaluated. By combining the proposed microwave digestion and inductively coupled plasma mass spectrometry techniques, the detection limits int the sub- ppb level and the analytical throughput up to 14 samples per hour were achieved for the analysis of nine metals. The novel process of using the identical bottom antireflective coating (BARC) material was applied to the KrF and ArF photoresist systems to reduce swing effect and surface reflectance on the substrate. It was found that the optimal thickness of the BARC film for the KrF and ArF photoresist systems were 62.5 nm and 119 nm, respectively.

Citation Download Citation

Fu-Hsiang Ko, Hsuen-Li Chen, Chun-Chen Hsu, and Tieh-Chi Chu "Metal characterization and process enhancement techniques for photolithographic materials", Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); https://doi.org/10.1117/12.473512

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