Negative photoresist for 157-nm microlithography; a progress report

Will Conley; Brian C. Trinque; Daniel A. Miller; Paul Zimmerman; Takanori Kudo; Ralph R. Dammel; Andrew R. Romano; C. Grant Willson

doi:10.1117/12.474187

24 July 2002 Negative photoresist for 157-nm microlithography; a progress report

Will Conley, Brian C. Trinque, Daniel A. Miller, Paul Zimmerman, Takanori Kudo, Ralph R. Dammel, Andrew R. Romano, C. Grant Willson

Author Affiliations +

Proceedings Volume 4690, Advances in Resist Technology and Processing XIX; (2002) https://doi.org/10.1117/12.474187
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

The design of 157 nm photoresists is a daunting task since air, water, and most organic compounds are opaque at this wavelength. Spectroscopic studies1 led to the observation that fluorinated hydrocarbons and siloxanes offer the best hope for the transparency that is necessary for the design of an effective 157nm photoresist, and these classes of materials have quickly become the prominent platforms for a variety of research activities in this field. There have been a number of authors that have suggested that negative resists have unique attributes for specific device applications. Numerous authors have discussed negative photoresists over the years. There are many uses for such materials at various levels in a semiconductor device. One such use is with complementary phase shift mask thus eliminating the need for a second exposure step. This paper reports our recent progress toward developing a negative 157nm resist materials based on fluoropolymers with crosslinkers that are transparent at 157nm. The authors will report on the synthesis of the polymers used in this work along with the crosslinkers and other additives used in the formulation of the photoresist. Imaging experiments at practical film thicknesses at 157nm with binary and strong phase shifting masks will be shown demonstrating imaging capabilities. Spectroscopic data demonstrating chemical mechanisms and material absorbance will be shown along with other process related information.

Citation Download Citation

Will Conley, Brian C. Trinque, Daniel A. Miller, Paul Zimmerman, Takanori Kudo, Ralph R. Dammel, Andrew R. Romano, and C. Grant Willson "Negative photoresist for 157-nm microlithography; a progress report", Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); https://doi.org/10.1117/12.474187

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