Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves

Dieter Schneider; Eva Stiehl; Ralf Hammer; Andreas Franke; Richard P. Riegert; Thomas Schuelke

doi:10.1117/12.475660

12 July 2002 Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves

Dieter Schneider, Eva Stiehl, Ralf Hammer, Andreas Franke, Richard P. Riegert, Thomas Schuelke

Proceedings Volume 4692, Design, Process Integration, and Characterization for Microelectronics; (2002) https://doi.org/10.1117/12.475660
Event: Design, Process Integration, and Characterization for Microelectronics, 2002, Santa Clara, CA, United States

Abstract

Slicing semi-conductor wafers form ingots produces a damage layer that ha to be completely removed by complex polishing and etching processes. Nondestructively controlling the machining process is desirable. Laser induced surface acoustic waves are demonstrated to be a promising method to characterize the state of the surface.

Citation Download Citation

Dieter Schneider, Eva Stiehl, Ralf Hammer, Andreas Franke, Richard P. Riegert, and Thomas Schuelke "Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves", Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); https://doi.org/10.1117/12.475660

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