Novel technique for fabrication of multilayered microcoils in microelectromechanical systems (MEMS) applications

Hung-Pin Chang; Jiangyuan Qian; Mark Bachman; Philip Congdon; Guann-pyng Li

doi:10.1117/12.475030

11 July 2002 Novel technique for fabrication of multi-layered microcoils in microelectromechanical systems (MEMS) applications

Hung-Pin Chang, Jiangyuan Qian, Mark Bachman, Philip Congdon, Guann-pyng Li

Author Affiliations +

Proceedings Volume 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology; (2002) https://doi.org/10.1117/12.475030
Event: SPIE's 9th Annual International Symposium on Smart Structures and Materials, 2002, San Diego, California, United States

Abstract

A novel planarization technique, compressive molding planarization (CMP) is developed for implementation of a multi-layered micro coil device. Applying CMP and other micromachining techniques, a multi-layered micro coil device has been designed and fabricated, and its use in the magnetic micro actuators for hard disk drive applications has been demonstrated, showing that it can produce milli-Newton of magnetic force suitable for driving a micro actuator. The novel CMP technique can be equally applicable in other MEMS devices fabrication to ease the process integration for the complicated structure.

Citation Download Citation

Hung-Pin Chang, Jiangyuan Qian, Mark Bachman, Philip Congdon, and Guann-pyng Li "Novel technique for fabrication of multi-layered microcoils in microelectromechanical systems (MEMS) applications", Proc. SPIE 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology, (11 July 2002); https://doi.org/10.1117/12.475030

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